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Mechanical, electrical and environmental solutions

06Mar

Cannon Electronic Packaging (CEP) announced a range of solutions to meet the requirements of today’s markets and applications.

This is the latest in a series of activities that have seen CEP form strategic partnerships with Polyrack Tech-Group; and Asis.

Utilising standards-based electronic packaging reduces upfront development costs and technical risk, while providing the latest proven technologies in a cost-effective platform. Included in CEP’s product portfolio are Polyrack Tech-Group’s market leading FutureX series comprising subrack and case solutions that come in a diverse range of heights, widths and depths to suit all requirements. Meanwhile, Asis produces an innovative range of 19” rack mountable ATCA chassis available in a variety of sizes from one to 14 slots, and which are suitable for use in a variety of markets, such as defence, medical and data centres.

CEP works closely with its partners to configure standard product platforms, off platform, customised off the shelf (COTS) and totally customised solutions. This is a full Level 1 to Level 5 service that also includes project management and production engineering controls, through to integration and test, transport, storage and end-of-life facilities.